Three-dimensional interconnect technology for ultra-compact MMICs
- 1 October 1997
- journal article
- Published by Elsevier BV in Solid-State Electronics
- Vol. 41 (10), 1451-1455
- https://doi.org/10.1016/s0038-1101(97)00088-9
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Highly integrated three-dimensional MMIC single-chip receiver and transmitterPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Multilayer MMIC using a 3 mu m*3-layer dielectric film structurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Three-dimensional passive circuit technology for ultra-compact MMICsIEEE Transactions on Microwave Theory and Techniques, 1995