The effect of adenine, guanine, saccharin, and coumarin on electroless copper deposition has been studied by cyclic voltammetry and the weight gain method. It was found that guanine and adenine accelerate electroless copper deposition. Coumarin and saccharin have almost no effect on the deposition process. Differences in the effect of these two groups of additives have been correlated to differences in the electronic structure of molecules.