Study of abrasive-particle size dependence of polishing rate based on a simple mechanical model
- 1 November 2014
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- CMP of hard disk substrate using a colloidal SiO2 slurry: preliminary experimental investigationWear, 2004
- Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO2Chemical Mechanical PolishingTribology Transactions, 2002
- The Bulking Properties of Microscopic ParticlesIndustrial & Engineering Chemistry, 1930