Rankings
Publications
Sources
Publishers
Scholars
Organizations
About
Login
Register
Home
Publications
Bonding characteristics during very high power ultrasonic additive manufacturing of copper
Home
Publications
Bonding characteristics during very high power ultrasonic additive manufacturing of copper
Bonding characteristics during very high power ultrasonic additive manufacturing of copper
M.R. Sriraman
M.R. Sriraman
S.S. Babu
S.S. Babu
MS
M. Short
M. Short
Publisher Website
Google Scholar
Cite
Download
Share
Download
29 April 2010
journal article
Published by
Elsevier BV
in
Scripta Materialia
Vol. 62
(8)
,
560-563
https://doi.org/10.1016/j.scriptamat.2009.12.040
Abstract
No abstract available
Cited by 108 articles