Thermal analysis and modelling of a copper-polyimide thin-film-on-silicon multichip module packaging technology
- 2 January 2003
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- Internal thermal resistance of a multi-chip packaging design for VLSI based systemsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Conduction Cooling for an LSI Package: A One-Dimensional ApproachIBM Journal of Research and Development, 1982