Rankings
Publications
Sources
Publishers
Scholars
Organizations
About
Login
Register
Home
Publications
Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
Home
Publications
Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
Hot embossing of microstructures with integrated conduction paths for the production of lab-on-chip systems
MH
Mathias Heckele
Mathias Heckele
FA
Frank Anna
Frank Anna
Publisher Website
Google Scholar
Cite
Download
Share
Download
19 April 2002
conference paper
Published by
SPIE-Intl Soc Optical Eng
Vol. 4755
,
670-674
https://doi.org/10.1117/12.462869
Abstract
Hot embossing allows directly integrating conduction paths made of gold in the channel structures required for applications in lab-on-chip systems. In experiments, ditch depths of more than 100 micrometers wide and 2-3 micrometers thick construction paths. It turned out to be of no relevance whether the inclination of the lateral walls was 45 degree(s) or 90 degree(s).© (2002) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
Keywords
GOLD
CHIP
MICROSTRUCTURES
All Articles
Open Access
Cited by 5 articles