Sintering strategies for inkjet printed metallic traces in 3D printed electronics

Abstract

Emerging from the 2D printed electronics, 3D printed electronics promise a break-through in additive manufacturing and prototyping of electronics. However, transferring the know-how from 2D flexible electronics to 3D parts with complex structures (e.g. internal vias and external interconnects) might not be a straightforward approach. As an example, the variation of light intensity with respect to the distance and angle of incidence casts doubt on the efficiency of the intense pulsed laser (IPL) as a robust sintering method for metallic traces in 3D printed bulk structures, whereas IPL is currently by far the most prevailing sintering technique for 2D printed flexible electronics. Sintering of metallic traces in 3D printed parts can be executed either as a sequential layer-by-layer printing and processing step (LP) or as a bulk post-processing step (BP). In the current study, a survey on the most common sintering strategies for inkjet printed silver nanoparticles was conducted, while the compatibility to 3D printed structures was brought into the focal point. To discover the capabilities and limitations of 6 sintering methods (i. e. IPL, ohmic curing, thermal heating, laser, atmospheric plasma and microwave sintering) for 3D printed electronics, a comparative study utilizing the same materials and diagnostic methods was pursued. The results revealed that for 3D functional parts, some of the sintering techniques can be considered as complementary methods for each other, whereas a few showed readily the potential to be adapted in 3D printed electronics production.