Ligand-free C–N bond formation in aqueous medium using a reusable Cu–Mn bimetallic catalyst
- 25 September 2013
- journal article
- research article
- Published by Elsevier BV in Tetrahedron Letters
- Vol. 54 (39), 5351-5354
- https://doi.org/10.1016/j.tetlet.2013.07.095
Abstract
No abstract availableKeywords
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