Using expert technology to select unstable slicing machine to control wafer slicing quality via fuzzy AHP
- 30 April 2008
- journal article
- Published by Elsevier BV in Expert Systems with Applications
- Vol. 34 (3), 2210-2220
- https://doi.org/10.1016/j.eswa.2007.02.042
Abstract
No abstract availableKeywords
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