Micro ultrasonic machining and self-aligned multilayer machining/assembly technologies for 3D micromachines
- 23 December 2002
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Self-aligned machining and assembly of high aspect ratio microparts into siliconPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Micro electro-discharge machining and its applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Non-traditional technologies for microfabricationJournal of Micromechanics and Microengineering, 1995
- Wire Electro-Discharge Grinding for Micro-MachiningCIRP Annals, 1985