Toughening of epoxy resins by modification with dispersed acrylate rubber for electronic packaging
- 15 October 1993
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 50 (3), 477-483
- https://doi.org/10.1002/app.1993.070500311
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Toughening epoxy resins by liquid crystalline polymersJournal of Applied Polymer Science, 1992
- Microstructure, mechanical properties, and fracture behavior of liquid rubber toughened thermosetsJournal of Applied Polymer Science, 1991
- Phase separation behavior of the epoxy‐CTBN mixture during the curing processPolymer Engineering & Science, 1991
- Study of rubber‐modified brittle epoxy systems. Part II: Toughening mechanisms under mode‐I fracturePolymer Engineering & Science, 1991
- Morphology and properties control on rubber‐epoxy alloy systemsPolymer Engineering & Science, 1990
- Thermal shock resistance of plastic IC packageJournal of Applied Polymer Science, 1990
- New Profile of Ultra Low Stress Resin Encapsulants for Large Chip Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Toughening mechanisms in elastomer-modified epoxiesJournal of Materials Science, 1986
- Low-Stress Resin Encapsulants for Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Synthesis, Morphology, and Thermal Stability of Elastomer-Modified Epoxy ResinsPublished by American Chemical Society (ACS) ,1983