Thermal Conductivity, Electrical Conductivity and Specific Heat of Copper-Carbon Fiber Composites
- 1 January 1987
- journal article
- Published by Japan Institute of Metals in Transactions of the Japan Institute of Metals
- Vol. 28 (10), 819-826
- https://doi.org/10.2320/matertrans1960.28.819
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Reciprocating Sliding Wear Characteristics of Copper-Carbon Fiber CompositesTransactions of the Japan Institute of Metals, 1987
- Application of Copper-Carbon Fiber Composites to Power Semiconductor DevicesJournal of the Japan Institute of Metals and Materials, 1986
- Reciprocating Sliding Wear Characteristics of Copper-Carbon Fiber CompositesJournal of the Japan Institute of Metals and Materials, 1986
- Thermal Expansion Behavior of Randomly Oriented Short Carbon Fiber Reinforced Copper CompositesJournal of the Japan Institute of Metals and Materials, 1985
- Thermal Conductivity, Electrical Conductivity and Specific Heat of Copper-Carbon Fiber CompositeJournal of the Japan Institute of Metals and Materials, 1985
- Thermal Expansion, Young’s Modulus and Poisson’s Ratio of Copper-Carbon Fiber CompositeJournal of the Japan Institute of Metals and Materials, 1985
- Low expansion copper. Carbon fiber composite material.Journal of the Japan Society for Composite Materials, 1984
- Development of Copper-Carbon Fiber Composite for Electrodes of Power Semiconductor DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The thermal conductivity of carbon fibre-reinforced compositesJournal of Materials Science, 1979