Submicrometer resolution replication of relief patterns for integrated optics

Abstract

We report on three techniques for replicating relief patterns in dielectric materials for use as substrates for planar integrated optical circuits: embossing with a metal die; casting from a metal die; and casting from a rubber mold. Techniques for overcoating the substrates with light‐guiding films and filling of grooves are also described. Measured losses in sheet film guides were ≤0.5 dB/cm. Guiding was also observed in narrow light guides fabricated by each technique. Embossing is the simplest process, but for small‐scale production the casting processes are simpler to implement.