Thermal Decomposition Mechanism of Ti ( O ‐ iPr ) 2 ( DPM ) 2

Abstract

The thermal decomposition behavior of has been studied using thermogravimetry and infrared and mass spectroscopy. Particularly, dissociation of the chemical bonds in the complex ligand have been monitored from the IR spectra of the complex while the sample was heated. is relatively stable, shows no weight loss at 150°C, and degrades only slightly after storage for a year. The thermogravimetric pattern of the complex is unaffected by ambient gases. The chemical bonds in the complex ligand dissociate sequentially at elevated temperatures. The C‒C bond dissociates most easily, then the C‒O bond and the C‒C bond. The O‒Ti‒O bond is stable up to the gasification temperature of the complex. Removal of the bulky tert‐butyl group from the ligand and dissociation of the C‒O bond to allow the ligand ring to open reduce the steric hindrance by the ligands, which eventually leads to the oligomerization of the complex. The complex oligomerizes at 110°C as confirmed by mass spectroscopy. © 1999 The Electrochemical Society. All rights reserved.