Proposed configuration of integrated optical isolator employing wafer-direct bonding technique
- 1 January 1997
- journal article
- Published by Institution of Engineering and Technology (IET) in Electronics Letters
- Vol. 33 (21), 1787-1788
- https://doi.org/10.1049/el:19971253
Abstract
A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of a wafer-direct bonding technique. Magnetic garnets with a large magneto-optic effect miniaturise the size of the nonreciprocal phase shifter to several hundreds of microns.Keywords
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