Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu–Al alloys during thermal annealing
- 11 January 2011
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Research
- Vol. 26 (3), 407-415
- https://doi.org/10.1557/jmr.2010.39
Abstract
No abstract availableKeywords
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