Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
- 31 May 1997
- journal article
- Published by Elsevier BV in Acta Materialia
- Vol. 45 (5), 1867-1874
- https://doi.org/10.1016/s1359-6454(96)00325-4
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Thermodynamics-aided alloy design and evaluation of Pb-free solder, SnBiInZn systemActa Materialia, 1997
- The effect of reflow process variables on the wettability of lead-free soldersJOM, 1993
- Microstructure and mechanical properties of Sn-In and Sn-Bi soldersJOM, 1993
- Developing lead-free solders: A challenge and opportunityJOM, 1993
- Progress in the design of new lead-free solder alloysJOM, 1993
- Converting to lead-free solders: An automotive industry perspectiveJOM, 1993
- Issues in the replacement of lead-bearing soldersJOM, 1993
- Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagramJournal of Phase Equilibria and Diffusion, 1993
- Multiphase diffusion in binary and ternary solid-state systemsProgress in Solid State Chemistry, 1990
- An assessment of the thermodynamic properties and phase diagram of the system Bi-CuThermochimica Acta, 1990