Correlations between mechanical stress, electrical conductivity and nanostructure in Al films on a polymer substrate
- 31 March 2010
- journal article
- Published by Elsevier BV in Materials Characterization
- Vol. 61 (3), 325-329
- https://doi.org/10.1016/j.matchar.2009.12.016
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- In situ TEM observations of fast grain-boundary motion in stressed nanocrystalline aluminum filmsActa Materialia, 2008
- Polymers for flexible displays: From material selection to device applicationsProgress in Polymer Science, 2008
- Mechanical annealing and source-limited deformation in submicrometre-diameter Ni crystalsNature Materials, 2007
- A wearable yarn-based piezo-resistive sensorSensors and Actuators A: Physical, 2007
- Nanoparticle films as sensitive strain gaugesApplied Physics Letters, 2007
- New materials for micro-scale sensors and actuatorsMaterials Science and Engineering: R: Reports, 2007
- Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin filmsActa Materialia, 2006
- Thermal stability of a nanostructured aluminium alloyMaterials Characterization, 2005
- Size dependence of mechanical properties of gold at the micron scale in the absence of strain gradientsActa Materialia, 2005
- Direct observation of diffusional creep via TEM in polycrystalline thin films of goldActa Materialia, 1998