Suppression of Cu Oxidation Using Environmentally Friendly Inhibitors under Conditions of High Temperature and High Humidity for Cu/Low-k
- 1 April 2009
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 48 (4S), 04C016
- https://doi.org/10.1143/jjap.48.04c016
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Measuring the Young’s modulus of ultralow-k materials with the non destructive picosecond ultrasonic methodMicroelectronic Engineering, 2006
- Development of Environmentally Safe Remover for Cu/Low-k DevicesJournal of The Surface Finishing Society of Japan, 2005
- Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor depositionApplied Physics Letters, 2001
- Surface Oxidation and Reduction of CuO and Cu2O Studied Using XPS and XAESSurface and Interface Analysis, 1996
- Impedance studies of the inhibitive effect of benzotriazole on the corrosion of copper in sodium chloride mediumCorrosion Science, 1980