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Plasma etching of organic materials. I. Polyimide in O2–CF4
Home
Publications
Plasma etching of organic materials. I. Polyimide in O2–CF4
Plasma etching of organic materials. I. Polyimide in O2–CF4
FE
F. D. Egitto
F. D. Egitto
FE
F. Emmi
F. Emmi
RH
R. S. Horwath
R. S. Horwath
VV
V. Vukanovic
V. Vukanovic
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1 May 1985
journal article
Published by
American Vacuum Society
in
Journal of Vacuum Science & Technology B
Vol. 3
(3)
,
893-904
https://doi.org/10.1116/1.583078
Abstract
No abstract available
Keywords
ORGANIC MATERIAL
PLASMA ETCHING
Cited by 121 articles