Solder self-assembly for three-dimensional microelectromechanical systems
- 2 November 1999
- journal article
- Published by Elsevier BV in Sensors and Actuators A: Physical
- Vol. 77 (3), 237-244
- https://doi.org/10.1016/s0924-4247(99)00220-4
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Rotational self-assembly of complex microstructures by the surface tension of glassSensors and Actuators A: Physical, 1998
- Micro-opto-electro-mechanical devices and on-chip optical processingOptical Engineering, 1997
- Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMSJournal of Microelectromechanical Systems, 1997
- Realizing micro-opto-electro-mechanical devices through a commercial surface-micromachining processPublished by SPIE-Intl Soc Optical Eng ,1996
- Actuation of polysilicon surface-micromachined mirrorsPublished by SPIE-Intl Soc Optical Eng ,1996
- Design of solder joints for self-aligned optoelectronic assembliesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Micro-scale force-transducer system to quantify isolated heart cell contractile characteristicsSensors and Actuators A: Physical, 1995
- Equilibrium of hinged and hingeless structures rotated using surface tension forcesJournal of Microelectromechanical Systems, 1995
- Demonstration of three-dimensional microstructure self-assemblyJournal of Microelectromechanical Systems, 1995