Electronic cooling of a submicron-sized metallic beam
- 16 February 2009
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 94 (7), 073101
- https://doi.org/10.1063/1.3080668
Abstract
We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.Other Versions
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