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The Limiting Rate of Deposition by P-R Plating
Home
Publications
The Limiting Rate of Deposition by P-R Plating
The Limiting Rate of Deposition by P-R Plating
HC
H. Y. Cheh
H. Y. Cheh
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1 January 1971
journal article
Published by
The Electrochemical Society
in
Journal of the Electrochemical Society
Vol. 118
(7)
,
1132-1134
https://doi.org/10.1149/1.2408262
Abstract
No abstract available
Keywords
ELECTROPLATING
GOLD
FILM CONDENSATION
MATHEMATICAL ANALYSIS
CURRENT DENSITY
DISSOCIATION
Cited by 37 articles