Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substrates
- 1 April 1978
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 49 (4), 2423-2426
- https://doi.org/10.1063/1.325084
Abstract
No abstract availableKeywords
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