Device parameter optimization for sub-20 nm node HK/MG-last bulk FinFETs
- 1 April 2015
- journal article
- research article
- Published by IOP Publishing in Journal of Semiconductors
- Vol. 36 (4), 044007
- https://doi.org/10.1088/1674-4926/36/4/044007
Abstract
Sub-20 nm node bulk FinFET PMOS devices with an all-last high-k/metal gate (HK/MG) process are fabricated and the influence of a series of device parameters on the device scaling is investigated. The high and thin Fin structure with a tapered sidewall shows better performance than the normal Fin structure. The punch through stop layer (PTSL) and source drain extension (SDE) doping profiles are carefully optimized. The device without SDE annealing shows a larger drive current than that with SDE annealing due to better Si crystal regrowth in the amorphous Fin structure after source/drain implantation. The band-edged MG has a better short channel effect immunity, but the lower effective work function (EWF) MG shows a larger driveability. A tradeoff choice for different EWF MGs should be carefully designed for the device's scaling.Keywords
This publication has 3 references indexed in Scilit:
- Tri-Gate Bulk MOSFET Design for CMOS Scaling to the End of the RoadmapIEEE Electron Device Letters, 2008
- Device Design and Optimization Considerations for Bulk FinFETsIEEE Transactions on Electron Devices, 2008
- High performance fully-depleted tri-gate CMOS transistorsIEEE Electron Device Letters, 2003