Dielectric, thermal, and mechanical properties of CeO2‐filled HDPE composites for microwave substrate applications
- 22 March 2010
- journal article
- research article
- Published by Wiley in Journal of Polymer Science Part B: Polymer Physics
- Vol. 48 (9), 998-1008
- https://doi.org/10.1002/polb.21988
Abstract
No abstract availableKeywords
Funding Information
- Department of Science and Technology, New Delhi
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