Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packages
- 30 December 2002
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Prediction and measurement of thermal conductivity of diamond filled adhesivesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermal enhancement of surface mount electronic packages with heat sinksPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Evaluation of a mixed flowing gas testPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1991
- Air Entrapment in the Use of Structural Adhesive FilmsThe Journal of Adhesion, 1972