Influence of porous Cu interlayer on the intermetallic compound layer and shear strength of MWCNT-reinforced SAC 305 composite solder joints
- 12 January 2021
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Science: Materials in Electronics
- Vol. 32 (4), 4515-4528
- https://doi.org/10.1007/s10854-020-05194-6
Abstract
No abstract availableKeywords
Funding Information
- Universiti Putra Malaysia (UPM/GP-IPB/2020/9688700)
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