High aspect ratio grooving of Si using a wet etching assisted by wire-friction (A feasibility study for the applicaiotn for slicing Si ingots)
- 1 January 2014
- journal article
- Published by Japan Society of Mechanical Engineers in Transactions of the JSME (in Japanese)
- Vol. 80 (815), SMM0183
- https://doi.org/10.1299/transjsme.2014smm0183
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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