Fringing capacitance and tolerance of DRIE effect on the performance of bulk silicon comb-drive actuator
- 16 June 2016
- journal article
- research article
- Published by Springer Science and Business Media LLC in Microsystem Technologies
- Vol. 23 (7), 2727-2738
- https://doi.org/10.1007/s00542-016-3014-0
Abstract
No abstract availableKeywords
Funding Information
- Fundamental Research Funds for the Central Universities (2014B02014)
- National High Technology Research and Development Program of China (2013AA041106)
This publication has 19 references indexed in Scilit:
- A water-tight packaging of MEMS electrostatic actuators for biomedical applicationsMicrosystem Technologies, 2010
- Low-temperature Au–Si wafer bondingJournal of Micromechanics and Microengineering, 2010
- Development of Vertical Electrostatic Comb-Drive Actuator Using Magnified Cascade ConfigurationJapanese Journal of Applied Physics, 2007
- Millimeter-sized nanomanipulator with sub-nanometer positioning resolution and large force outputSmart Materials and Structures, 2007
- Influence of deep RIE tolerances on comb-drive actuator performanceJournal of Physics D: Applied Physics, 2007
- Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technologyJournal of Micromechanics and Microengineering, 2006
- Tolerance analysis for comb-drive actuator using DRIE fabricationSensors and Actuators A: Physical, 2006
- Design of large deflection electrostatic actuatorsJournal of Microelectromechanical Systems, 2003
- Polycrystalline silicon-germanium films for integrated microsystemsJournal of Microelectromechanical Systems, 2003
- Optimal shape design of an electrostatic comb drive in microelectromechanical systemsJournal of Microelectromechanical Systems, 1998