Investigation on Anisotropy Shrinkage and Conductivity of Ag Microwires Sintering Assisted by the Tamping Effect of Alternating Electric Field
- 3 March 2020
- journal article
- research article
- Published by The Electrochemical Society in ECS Journal of Solid State Science and Technology
- Vol. 9 (3), 034006
- https://doi.org/10.1149/2162-8777/ab7cc2
Abstract
Alternating electric fields with different periods and duty ratios were applied during the sintering of Ag microwire to improve its shrinkage and conductivity. Compared with the electrostatic field with the same electric field intensity of 800 V cm(-1), the shrinkage rates of Ag microwires heated in the alternating electric field with the period of 15 min, 30 min and 45 min are demonstrated to improve 1.064%, 1.864% and 1.066% at most with different duty ratios, respectively. Besides, the conductivities and grain sizes of Ag microwires heated in the alternating electric field with the period of 15 min, 30 min and 45 min are corresponding with the shrinkage rates when duty ratio changes. According to the experimental data, the optimal sintering properties of the alternating electric field with the period of 15 min, 30 min and 45 min are at the duty ratios of 9:1, 4:1 and 4:1, respectively. However, when the duty ratio is certain, the sintering properties of the alternating electric field with the period of 30 min are the best, followed by the period of 45 min, and the sintering properties of the he alternating electric field with the period of 15 min turn out to be the worst in the three alternating electric field groups. These results can be explained by the nonlinearity of the sintering process and "tamping effect" of the alternating electric field. This method may further improve the density and conductivity of Ag microwires, which are used as interconnects after sintering. (C) 2020 The Electrochemical Society ("ECS"). Published on behalf of ECS by IOP Publishing Limited.Keywords
Funding Information
- National Natural Science Foundation of China (51475436, U1704155, 51175479)
- Program for Innovative Research Team in University of Henan Province, China (18IRTSTHN016)
This publication has 26 references indexed in Scilit:
- 56nm pitch Cu dual-damascene interconnects with self-aligned via using negative-tone development Lithography-Etch-Lithography-Etch patterning schemeMicroelectronic Engineering, 2013
- Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticlesMaterials Letters, 2012
- Low-temperature low-pressure die attach with hybrid silver particle pasteMicroelectronics Reliability, 2012
- Tunning of microstructure and thermoelectric properties of Ca3Co4O9 ceramics by high-magnetic-field sinteringJournal of Applied Physics, 2011
- Inkjet printing of palladium alkanethiolates for facile fabrication of metal interconnects and surface-enhanced Raman scattering substratesMicro & Nano Letters, 2010
- Organic Solar Cells Using Nanoimprinted Transparent Metal ElectrodesAdvanced Materials, 2008
- EFFECT OF IMPROPER BALLAST PACKING/TAMPING ON DYNAMIC BEHAVIORS OF ON-TRACK RAILWAY CONCRETE SLEEPERInternational Journal of Structural Stability and Dynamics, 2007
- Voiding induced stress redistribution and its reliability implications in metal interconnectsActa Materialia, 2000
- Laser linking of metal interconnects: analysis and design considerationsIEEE Transactions on Electron Devices, 1996
- High-efficiency organometallic vapor phase epitaxy AlGaAs/GaAs monolithic cascade solar cell using metal interconnectsApplied Physics Letters, 1982