Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle Tests
- 1 January 2013
- journal article
- Published by IMAPS - International Microelectronics Assembly and Packaging Society in International Symposium on Microelectronics
- Vol. 2013 (1), 000902-000907
- https://doi.org/10.4071/isom-2013-thp47