A novel transfer learning fault diagnosis method based on Manifold Embedded Distribution Alignment with a little labeled data
- 8 September 2020
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Intelligent Manufacturing
- Vol. 33 (1), 151-165
- https://doi.org/10.1007/s10845-020-01657-z
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (No. 91860124, No. 51875459)
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