Size dependency in stacking fault-mediated ultrahard high-entropy alloy thin films
- 28 June 2020
- journal article
- research article
- Published by Elsevier BV in Journal of Alloys and Compounds
- Vol. 844, 156187
- https://doi.org/10.1016/j.jallcom.2020.156187
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (11922215)
- Shenzhen Science and Technology Innovation Committee (JCYJ20160401100358589, JCYJ20170413141157573)
- City University of Hong Kong (9667153, 6000604, 6986049)
- Collaborative Research Fund (C1027-14E)
- Research Grant Council of Hong Kong
This publication has 65 references indexed in Scilit:
- Grain growth and the Hall–Petch relationship in a high-entropy FeCrNiCoMn alloyScripta Materialia, 2013
- Mechanical properties of highly textured Cu/Ni multilayersActa Materialia, 2011
- Quantitative binomial distribution analyses of nanoscale like‐solute atom clustering and segregation in atom probe tomography dataMicroscopy Research and Technique, 2008
- Toward a quantitative understanding of mechanical behavior of nanocrystalline metalsActa Materialia, 2007
- Evaluating modulus and hardness enhancement in evaporated Cu/W multilayersActa Materialia, 2007
- Indentation-induced phase transformations in silicon: influences of load, rate and indenter angle on the transformation behaviorActa Materialia, 2005
- Calculation of the surface energy of fcc metals with modified embedded-atom methodChinese Physics, 2004
- Effects of the substrate on the determination of thin film mechanical properties by nanoindentationActa Materialia, 2002
- Soft films on hard substrates — nanoindentation of tungsten films on sapphire substratesMaterials Science and Engineering: A, 2001
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992