Improved dielectric and thermal properties of core-shell structured SiO2/polyolefin polymer composites for high-frequency copper clad laminates
- 1 January 2021
- journal article
- research article
- Published by Elsevier BV in Applied Surface Science
- Vol. 544, 148911
- https://doi.org/10.1016/j.apsusc.2020.148911
Abstract
No abstract availableKeywords
This publication has 33 references indexed in Scilit:
- Preparation of ultra-low dielectric constant silica/polyimide nanofiber membranes by electrospinningComposites Part A: Applied Science and Manufacturing, 2016
- Hybrid ternary composites of hyperbranched and linear polyimides with SiO2: a research for low dielectric constant and optimized propertiesRSC Advances, 2014
- Non‐Porous Low‐k Dielectric Films Based on a New Structural Amorphous FluoropolymerAdvanced Materials, 2013
- Dielectric behavior of aluminum hydroxide‐filled oil‐extended ethylene‐propylene‐diene‐monomer rubber composites in microwave fieldsPolymer Engineering & Science, 2012
- Use of EPDMSDD as compatibilizer agent for EPDM/EPDMR blends: Rheologic, mechanical, and morphologic propertiesJournal of Applied Polymer Science, 2011
- Surface modification of silica nanoparticles with hydrophilic polymersJournal of Industrial and Engineering Chemistry, 2010
- Reinforcement of liquid ethylene–propylene–dicyclopentadiene copolymer based elastomer with vinyl functionalized multiwalled carbon nanotubesPolymer Engineering & Science, 2010
- Review of polymer materials with low dielectric constantPolymer International, 2010
- Low Dielectric Constant MaterialsChemical Reviews, 2009
- Low dielectric constant materials for microelectronicsJournal of Applied Physics, 2003