The reliability assessment of Au–Al bonds using parallel gap resistance microwelding
- 5 March 2020
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Science: Materials in Electronics
- Vol. 31 (8), 6313-6320
- https://doi.org/10.1007/s10854-020-03187-z
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51572190)
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