Effect of pH Value on Electroless Deposition of Copper Graphite Powders
- 15 January 2021
- journal article
- research article
- Published by Pleiades Publishing Ltd in Protection of Metals and Physical Chemistry of Surfaces
- Vol. 57 (1), 132-138
- https://doi.org/10.1134/s2070205120060192
Abstract
The effect of pH value on the electroless deposition of copper coated graphite powders (Cu@GPs) was investigated in this paper. The cathodic and anodic polarization curves were determined by linear sweep voltammetry in the plating at various pH value. pH value increasing can reduce the initial oxidation potential of formaldehyde, increase peak current density and accelerate electroless copper nuclei generated by the reduction reaction. With increasing pH value Cu+ disproportionation reaction was inhibited. Through the complexation competition and discharge competition among them, Na2EDTA, –OH and TART affect the reduction of cupric ions. The increasing pH value promote the formation of copper nuclei on the surface of graphite powders. Uniform Cu@GPs were fabricated by optimizing the pH 12.5~13. The copper plating layer is tightly combined with graphite, and the coating is complete.Keywords
This publication has 23 references indexed in Scilit:
- Role of additives in electroless copper plating using hypophosphite as reducing agentSurface and Coatings Technology, 2012
- Study of a pre-treatment process for electroless copper plating on ceramicsThin Solid Films, 2011
- Microwave sintering of copper–graphite compositesJournal of the American Academy of Dermatology, 2009
- Fabrication and properties of graphite flakes/metal composites for thermal management applicationsScripta Materialia, 2008
- Preparation of Cu coating on graphite electrode foil and its suppressive effect on PC decompositionSolid State Ionics, 2007
- Effect of organic additives on structure, resistivity, and room-temperature recrystallization of electrodeposited copperMicroelectronic Engineering, 2004
- Effect of surface metallization of graphite on the tribological properties of copper hybrid compositesScandinavian Journal of Metallurgy, 2004
- The Deposition Characteristics of Accelerated Nonformaldehyde Electroless Copper PlatingJournal of the Electrochemical Society, 2003
- Improved ABS plastic activating treatment for electroless copper platingPolymer, 1995
- Voltammetric and Chronopotentiometric Study of the Anodic Oxidation of Methanol, Formaldehyde, and Formic AcidJournal of the Electrochemical Society, 1962