Investigation of the Thermal Properties of Electrodes on the Film and Its Heating Behavior Induced by Microwave Irradiation in Mounting Processes
Open Access
- 8 May 2020
- Vol. 8 (5), 557
- https://doi.org/10.3390/pr8050557
Abstract
We have developed a novel microwave (MW) soldering system using a cylindrical single-mode TM110 MW cavity that spatially separates the electric fields at the top and bottom of the cavity and the magnetic field at the center of the cavity. This MW reactor system automatically detects the suitable resonance frequency and provides the optimum MW irradiation conditions in the cylindrical cavity via a power feedback loop. Furthermore, we investigated the temperature properties of electrodes by MW heating with the simulation of a magnetic field in the TM110 cavity toward the mounting of electronic components by MW heating. We also developed a short-time melting technology for solder paste on polyimide substrate using MW heating and succeeded in mounting a temperature sensor using the novel MW heating system without damaging the electronic components, electronic circuits, and the substrate.This publication has 27 references indexed in Scilit:
- Wearable potentiometric ion sensorsTrAC Trends in Analytical Chemistry, 2018
- Flexible, Stretchable Sensors for Wearable Health Monitoring: Sensing Mechanisms, Materials, Fabrication Strategies and FeaturesSensors, 2018
- Internet of Things: A survey on the security of IoT frameworksJournal of Information Security and Applications, 2018
- Future Edge Cloud and Edge Computing for Internet of Things ApplicationsIEEE Internet of Things Journal, 2018
- Hydraulically amplified self-healing electrostatic actuators with muscle-like performanceScience, 2018
- A review of smart home applications based on Internet of ThingsJournal of Network and Computer Applications, 2017
- High-temperature lead-free solders: Properties and possibilitiesJOM, 2009
- Rapid manufacturing of metal components by laser formingInternational Journal of Machine Tools and Manufacture, 2006
- Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applicationsMaterials Science and Engineering: R: Reports, 2006
- Lead-free Solders in MicroelectronicsMaterials Science and Engineering: R: Reports, 2000