Enabling Security of Heterogeneous Integration: From Supply Chain to In-Field Operations
- 25 April 2023
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test
- Vol. 40 (5), 86-95
Witnessing significant signs of a slowdown of Moore’s law and Dennard scaling has pushed leading semiconductor companies toward advanced packaging with heterogeneous integration (HI) to stay away from the challenges of monolithic IC in more shrunk technology with higher complexity. In light of the advances made in monolithic ICs, this paper explores how these promising solutions can be extended for secure HI. For this purpose, by investigating the trustworthiness of the system-in-package (SiP) supply chain, we introduce possible trust validation and attack mitigation methodologies leading to establishing the fundamentals of end-to-end secure HI.
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