Journal of Electronic Packaging

Journal Information
ISSN / EISSN : 10437398 / 15289044
Current Publisher: ASME International (10.1115)
Total articles ≅ 1,939
Google Scholar h5-index: 21
Current Coverage
SCOPUS
SCIE
COMPENDEX
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Latest articles in this journal

Pradeep Lall, Kartik Goyal, Nakul Kothari, Benjamin Leever, Scott Miller
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047473

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Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047471

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H. Peter De Bock, David Huitink, Patrick Shamberger, James Spencer Lundh, Sukwon Choi, Nicholas Niedbalski, Lauren Boteler
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047474

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Jae Choon Kim, Zongqing Ren, Anil Yuksel, Ercan M. DeDe, Prabhakar R. Bandaru, Dan Oh, Jaeho Lee
Journal of Electronic Packaging, Volume 143; doi:10.1115/1.4047414

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Mei-Chien Lu
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047472

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Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047409

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Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047470

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Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal of Electronic Packaging, Volume 143; doi:10.1115/1.4047475

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Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047497

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Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal of Electronic Packaging, Volume 142; doi:10.1115/1.4047469

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