IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

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ISSN / EISSN : 02780070 / 19374151
Total articles ≅ 6,988
Google Scholar h5-index: 39
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Zhifei Wang, Peng Yang, Yi-Shing Chang, Jiang Xu, Xuanqi Chen, Zhehui Wang, Jun Feng
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 640-653; doi:10.1109/tcad.2019.2894792

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Peng Yang, Zhehui Wang, Zhifei Wang, Jiang Xu, Yi-Shing Chang, Xuanqi Chen, Rafael K. V. Maeda, Jun Feng
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 626-639; doi:10.1109/tcad.2019.2894810

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Irith Pomeranz
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 742-746; doi:10.1109/tcad.2019.2894675

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Zuomin Zhu, Wei Zhang, Vivek Chaturvedi, Amit Kumar Singh
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 686-699; doi:10.1109/tcad.2019.2894835

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Qin Wang, Ulf Schlichtmann, Yici Cai, Weiqing Ji, Zeyan Li, Haena Cheong, Oh-Sun Kwon, Hailong Yao, Tsung-Yi Ho, Kwanwoo Shin, et al.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 613-625; doi:10.1109/tcad.2019.2894820

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Gabriel A. G. Andrade, Marleson Graf, Luiz C. V. Dos Santos
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 728-741; doi:10.1109/tcad.2019.2894376

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Fabio Passos, Elisenda Roca, Javier Sieiro, Rafaella Fiorelli, Rafael Castro-Lopez, Jose Maria Lopez-Villegas, Francisco V. Fernandez
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 560-571; doi:10.1109/tcad.2018.2890528

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Ying Zhang, Krishnendu Chakrabarty, Zebo Peng, Ahmed Rezine, Huawei Li, Petru Eles, Jian Hui Jiang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 714-727; doi:10.1109/tcad.2018.2890695

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Sedigheh Kouhpayeh-Zadeh-Esfahani, A. Abdipour, Kambiz Afrooz
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 39, pp 670-674; doi:10.1109/tcad.2018.2890529

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