Microjoining developments of ASS316L/AZ31 TLP bonds using Cu and Ni high temperature solid state diffusion
Open Access
- 1 September 2019
- journal article
- research article
- Published by Egypts Presidential Specialized Council for Education and Scientific Research in Journal of Engineering Science and Military Technologies
- Vol. 3 (1), 37-41
- https://doi.org/10.21608/ejmtc.2019.12015.1114