TiO2/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LEDs
Open Access
- 1 April 2021
- journal article
- Published by Universitas Ahmad Dahlan in TELKOMNIKA (Telecommunication Computing Electronics and Control)
- Vol. 19 (2), 599-602
- https://doi.org/10.12928/telkomnika.v19i2.16755