A Novel Analytical Model for Ohmic Contacts to Planar Devices: Theoretical Design and Experimental Verification
- 26 November 2020
- journal article
- research article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 68 (1), 299-306
- https://doi.org/10.1109/ted.2020.3037880
Abstract
Designing a reasonable electrode size and obtaining precise contact resistance parameters are always crucial in the field of chip manufacturing, especially in the cases of tiny chips with very low contact resistance. In this work, an improved analytical model featuring an electrode-pair (EP) layout design is proposed to accurately extract the electrical parameters of the planar Ohmic contact. The key feature of the proposed model layout is the adoption of a series of EPs with a fixed interval distance but varied electrode widths which is just opposite to the conventional transmission line model (TLM). Then, the effective electrode width depending on the conduction current requirement and practical Ohmic contact technology level in production can hence be derived to assist the engineers for a better design in chip layout. Furthermore, the model is analyzed and demonstrated by performing both technology computer-aided design (TCAD) simulations and experimental measurements. The results verify the ability to achieve more precise contact resistance parameters and distinguish the variance of the sheet resistance underneath the contact after annealing treatment by the proposed EP model (EPM). This work provides a distinct perspective to understand and quantify the electrical characteristics in a greater variety of Ohmic contacts.Keywords
Funding Information
- National Science Foundation of China (61971090, 51607022)
- Fundamental Research Funds for the Central Universities (DUT20LK10)
- Open Project Program of Key Laboratory of Semiconductor Materials Science (KLSMS-1804)
- Chinese Academy of Sciences
This publication has 26 references indexed in Scilit:
- GaN-on-Si Power Technology: Devices and ApplicationsIEEE Transactions on Electron Devices, 2017
- Au-free ohmic Ti/Al/TiN contacts to UID n-GaN fabricated by sputter depositionJournal of Applied Physics, 2017
- Ohmic contacts to Gallium Nitride materialsApplied Surface Science, 2016
- Impact of Ti/Al atomic ratio on the formation mechanism of non-recessed Au-free Ohmic contacts on AlGaN/GaN heterostructuresJournal of Applied Physics, 2016
- Contacts between Two- and Three-Dimensional Materials: Ohmic, Schottky, and p–n HeterojunctionsACS Nano, 2016
- Mechanism of Ti/Al/Ti/W Au-free ohmic contacts to AlGaN/GaN heterostructures via pre-ohmic recess etching and low temperature annealingApplied Physics Letters, 2015
- High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructureMicroelectronics Reliability, 2012
- Towards proper characterization of nonlinear metal-semiconductor contacts. Generalization of the transmission line methodApplied Physics Letters, 2011
- Characterization of Au and Al segregation layer in post-annealed thin Ti∕Al∕Mo∕Au Ohmic contacts to n-GaNJournal of Applied Physics, 2005
- Electrical, thermal, and microstructural characteristics of Ti/Al/Ti/Au multilayer Ohmic contacts to n-type GaNJournal of Applied Physics, 2003