Analysis on Micro Complex Shape Via Hole Punching on Low Temperature Co-Fired Ceramics
Open Access
- 1 January 2020
- journal article
- Published by Scientific Research Publishing, Inc. in New Journal of Glass and Ceramics
- Vol. 10 (01), 1-13
- https://doi.org/10.4236/njgc.2020.101001
Abstract
The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance are changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap have little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant in other aspects of hole quality. Post-sintering investigation is also observed and discussed.<Keywords
This publication has 9 references indexed in Scilit:
- Fabrication of micro punching mold for micro complex shape part by micro EDMThe International Journal of Advanced Manufacturing Technology, 2018
- Overview on low temperature co-fired ceramic sensorsSensors and Actuators A: Physical, 2015
- OPTIMIZATION OF SHRINKAGE AND SURFACE-ROUGHNESS OF LTCC TAPEInternational Journal of Research in Engineering and Technology, 2013
- Response Predicting LTCC Firing Shrinkage: A Response Surface Analysis StudyJournal of Microelectronics and Electronic Packaging, 2009
- Development of a micro-punching machine and study on the influence of vibration machining in micro-EDMJournal of the American Academy of Dermatology, 2006
- Investigation of interactions between co-fired LTCC componentsJournal of the European Ceramic Society, 2005
- Micro-hole fabrication by mechanical punching processJournal of the American Academy of Dermatology, 2005
- Integration Concepts for the Fabrication of LTCC StructuresInternational Journal of Applied Ceramic Technology, 2005
- Burr formation during micro via-hole punching process of ceramic and PET double layer sheetThe International Journal of Advanced Manufacturing Technology, 2005