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Analysis on Micro Complex Shape Via Hole Punching on Low Temperature Co-Fired Ceramics

Vahdat Astani Chee, Junfeng Yang, Zuyuan Yu, Astani Che Vahdat, Yang Junfeng
New Journal of Glass and Ceramics , Volume 10, pp 1-13; doi:10.4236/njgc.2020.101001

Abstract: The quality of a via hole on a multilayer stack of Low Temperature Co-fired Ceramic (LTCC) tape is of utmost importance to its functionality. This paper investigates a substitute for the commonly used circular shape hole to a more complex one and its implications when different parameters such as sheet thickness, punch speed, travel distance and tool clearance are changed. Fabrication of the punch tools and the punching process is carried out at the same machine, ensuring alignment. Two types of non-circular shape are chosen to carry out the experiment. Pre-sintered complex shape hole measurements show that while punch conditions such as speed and tool gap have little effect on the size, sheet thickness and travel depth play a vital role in the overall dimension. Albeit having only a slight effect on the size, those parameters are significant in other aspects of hole quality. Post-sintering investigation is also observed and discussed.<
Keywords: Low Temperature Co-Fired Ceramic Packaging / Non-Circular Via Holes / Micro-Hole Punching

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