Abstract
Tin (Sn) films are electrodeposited on Au seed layers for the investigation of superconductivity. The effects of the presence of suppressing additives in electrolyte, the thickness of Sn films, and the room temperature aging of deposited Sn films on the superconducting transition behavior are systematically studied. In addition, the crystallographic structure of electrodeposited Sn and its evolution along with aging time are characterized and are discussed in conjunction with the superconductivity behavior. The current work represents an important step towards the processing of technologically viable superconducting devices.