Investigation of Radiation Hardening by Back-Channel Adjustment in PDSOI MOSFETs

Abstract
Total ionizing dose degradation is caused by radiation-induced charge buildup in oxides. Radiation hardening of SOI devices with deep submicron nodes or nano-nodes is mainly concerned with the field oxide and buried oxide. In this paper, a back-channel adjustment technique for TID hardening is proposed. The technique is compatible with the 130 nm PDSOI commercial process with no extra effort applied to the design. After testing the key electrical parameters and characterizing the radiation tolerance of the typical T-gate I/O NMOS devices, the results show that the radiation tolerance of the devices can reach more than 1 Mrad(Si) with the back-channel adjustment technique, and electrical performance is comparable to that of commercial process devices.