Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package
- 25 July 2022
- journal article
- research article
- Published by Institute of Electronics, Information and Communications Engineers (IEICE) in IEICE Electronics Express
- Vol. 19 (14), 20220122
- https://doi.org/10.1587/elex.19.20220122
Abstract
Due to the advantages of good thermal and electrical performance, lower cost, greater design flexibility, fan-out wafer-level package(FOWLP) has been widely used in millimeter-wave applications. In this letter, a fan-out wafer-level package with the size of 12mm×12mm for the millimeter-wave applications is accomplished by the redistribution layer first(RDL-First) process. The double-sided multiple redistribution layers(RDLs) are used to fan out the signals and to form the antenna-in-package(AiP). An antenna integration scheme for the Ultra Short Range automotive Radar(USRR) chips with four transmit and receive channels was achieved. In addition, a 1×3 series fed aperture-coupled antenna array in the fan-out area was designed. Correspondingly, a probe based antenna measurement setup for FOWLP-AiP working in E band was carried out. The measurement results are in good agreement with the simulation.Keywords
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