Mechanical Properties and Thermal Stability of the High-Thermoelectric-Performance Cu2Se Compound
- 14 September 2021
- journal article
- research article
- Published by American Chemical Society (ACS) in ACS Applied Materials & Interfaces
- Vol. 13 (38), 45736-45743
- https://doi.org/10.1021/acsami.1c12533
Abstract
The Cu2Se compound possesses extraordinary thermoelectric performance at high temperatures and shows great potential for the application of waste heat recycling. However, a thermoelectric device usually undergoes mechanical vibration, mechanical and/or thermal cycling, and thermal shock in service. Therefore, mechanical properties are of equal importance as thermoelectric performance. However, the mechanical performance and stability of the Cu2Se compound during long-term service at high temperatures have rarely been reported. In this study, we systematically investigated the mechanical properties of Cu2Se compounds synthesized by three varied methods (melting (M), self-propagating high-temperature synthesis (SHS), and a combination of SHS and ultrasonic treatment (UT)) and investigated the thermal stability of the SHS-UT compound under different annealing temperatures. The SHS-UT process effectively refines the grain size from 19 μm for the melting sample to 5 μm for the SHS-UT sample. The high density of grain boundaries in the SHS-UT sample effectively dissipates the energy of crack propagation; thus, the mechanical properties are greatly improved. The compressive strength, bending strength, and Vickers hardness of the SHS-UT sample are 147 MPa, 52.6 MPa, and 0.46 GPa, respectively, which are 21.5, 16.6, and 35.3% higher than those of the melting sample, respectively. Moreover, excellent thermal stability is achieved in the compound prepared by SHS and ultrasonication at a temperature below 873 K. After annealing at temperatures up to 873 K for 7 days, the excellent thermoelectric performance of the Cu2Se compound is well maintained with a ZT value exceeding 1.80 at 873 K. However, with further increasing the annealing temperature to 973 K, the volatilization of Se and the precipitation of Cu result in the instability and significantly deteriorated thermoelectric performance of the material. This work provides an avenue for boosting the mechanical properties and commercial application of Cu2Se.Funding Information
- Ministry of Science and Technology of the People's Republic of China (2019YFA0704900)
- National Natural Science Foundation of China (51521001, 51632006, 51972256)
- Higher Education Discipline Innovation Project (B07040)
- Wuhan Frontier Project on Applied Research Foundation (2019010701011405)
This publication has 37 references indexed in Scilit:
- Band Engineering of Thermoelectric MaterialsAdvanced Materials, 2012
- High-performance bulk thermoelectrics with all-scale hierarchical architecturesNature, 2012
- Copper ion liquid-like thermoelectricsNature Materials, 2012
- Resonant levels in bulk thermoelectric semiconductorsEnergy & Environmental Science, 2011
- Thermoelectric and transport properties of nanostructured Bi2Te3 by spark plasma sinteringJournal of Materials Research, 2011
- High thermoelectric figure of merit in heavy hole dominated PbTeEnergy & Environmental Science, 2011
- Enhancement of Thermoelectric Efficiency in PbTe by Distortion of the Electronic Density of StatesScience, 2008
- Mechanical behavior of nanocrystalline metals and alloysActa Materialia, 2003
- Effects of heating rate on densification and grain growth during field-assisted sintering of α-Al2O3 and MoSi2 powdersMetallurgical and Materials Transactions, 2001
- Doping Effects on Mechanical Properties and Microhardness of Cu2−xSephysica status solidi (a), 1991