Characterization of thermally evaporated copper selenide thin films for device applications
- 1 January 2022
- journal article
- Published by Elsevier BV in Materials Today
- Vol. 55, 22-25
- https://doi.org/10.1016/j.matpr.2021.11.644
Abstract
No abstract availableFunding Information
- UGC DAE Consortium for Scientific Research (CSR–IC–MSRSR-11/CRS-219/2017–18/1300)
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